產品列表
產品圖片 名稱 型號 主要成份 熔點/PH值 粘度/比重 作業溫度 應用 儲存條件
美國AMTECH助焊膏 RMA-223-uv/NC-559-asm 美國AMTECH助焊膏(NC-559-ASM和RMA-223-UV)二.產品介紹:美國AMTECH研發了兩種使用於手機PCB,BGA及PGA等SMD之返修助焊膏,它使用於低離子性之活化劑係統,潤錫速度快,冒煙程度很低,殘留物固化後之表麵絕緣阻抗值很高,因此,對手機等通訊產品之電性幹擾非常小.
AMTECH助焊膏 RMA-223-UV AMTECH助焊膏(NC-559和RMA-223)二.產品介紹:美國AMTECH研發了兩種使用於手機PCB,BGA及PGA等SMD之返修助焊膏,它使用於低離子性之活化劑係統,潤錫速度快,冒煙程度很低,殘留物固化後之表麵絕緣阻抗值很高,因此,對手機等通訊產品之電性幹擾非常小.
無鹵助焊膏 NC-669-LF 無鹵助焊膏NC-669-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold)
水洗助焊膏 LF-4300-TF 水洗助焊膏LF-4300-TFThe LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-lead and lead-free alloys. LF-4300-TF is ideal for BGA
AMTECH水洗無鉛茄子视频APP LF-4300 AMTECH水洗無鉛茄子视频APPIntroducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it.
AMTECH水洗茄子视频APP NWS-4200 AMTECH水洗茄子视频APPAll AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes.
AMTECH無鉛茄子视频APP WS4900 AMTECH無鉛茄子视频APPSolder Paste formulae designed for today’s Surface Mount Technologies. All AMTECH solder pastes are available for immediate delivery in jars
水洗有鉛茄子视频APP 4300 水洗有鉛茄子视频APP 一.產品特點 1.采用合成助焊膏 2.有著長時間的模板印刷壽命 3.寬的工藝窗口 4.對大多數電路板都擁有優良的潤濕性和優異的兼容性 5.有效的抑製BGA的空洞,且沒有錫珠和立碑 6. 助焊劑殘留物清晰,符合SIR根據IPC-TM-650.2.6.33的要求
AMTECH助焊筆 AMTECH FLUX-RIGHTER AMTECH助焊筆All AMTECH liquid fluxes are available in Flux-Righters, a unique tool for rework and touch-up soldering.

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